Description
Excimer laser lithography, silyation, small-ring x-ray technology, new resist materials, and multilayer processes are creating new optimum standards in IC fabrication. This hands-on reference will enable engineers to utilize the most promising innovations to improve IC process resolution, solve adhesion problems, achieve better-quality images, and speed up production- that is, to realize optimum performance standards in all phases of integrated-circuit fabrication. The text explains and develops concepts and applications in a logical way, following the fabrication process from crystal growth through the stages of etching, deposition, and doping-with the interrelationships of procedures clearly laid out. At each stage of the process, technical data and illustrations are provided to help the reader understand the how's and why's, which makes this the best first source on IC fabrication technology for process engineers, engineering managers, and materials and equipment vendors.
ISBN:9780071007368